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FR4 Multilayer PCB Manufacturing With Blue Peelable Mask Layer

FR4 Multilayer PCB Manufacturing With Blue Peelable Mask Layer

FR4 Multilayer PCB Manufacturing With Blue Peelable Mask Layer
FR4 Multilayer PCB Manufacturing With Blue Peelable Mask LayerFR4 Multilayer PCB Manufacturing With Blue Peelable Mask LayerFR4 Multilayer PCB Manufacturing With Blue Peelable Mask LayerFR4 Multilayer PCB Manufacturing With Blue Peelable Mask Layer
CategoriesMultilayer PCB
AlbumView larger image
BrandPCBQuick
MaterialFR4
Board Thickness1.6mm
Soldermask ColorGreen
Silkscreen ColorWhite
Surface TechnicsENIG
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Update Time2018-12-10
Detail Information
Blue peelable mask layer is applied to:
1. Corrosion protection of various acid and alkali solutions;

2. Protection against electric corrosion of various electroplating solutions;

3. Various electroless plating protection.

Do not print blue glue under the following circumstances

1, surface treatment for tin, silver and other easy to be oxidized and easy to wipe the board, not printed blue glue.
Reason: this plate surface treatment process is easy to be oxidized, can not bake the plate, but after printing the blue glue must be through the baking plate to solidify the blue glue.

2, not double-sided printing blue glue.Reason: 
A) double-sided blue glue enters the hole, and it is difficult to tear off the blue glue;
B) after printing one side, the blue glue bulges, causing uneven, inconvenient printing the other side, and easy to cause plate bending problems;
C) plate bending is not easy to measure.
Peelable mask pcb performance
1. No solvent volatilization, environmental protection and safety, almost 100% solid content, almost the same thickness of dry and wet film;

2. High thixotropy, effectively ensuring smooth screen printing edge, strong cover pore force and slight vertical flow;

3, good adhesion is not peeling off;

4. Easy to peel, complete, no residual flow, no impact on the bottom layer;

5, does not contain any metal and non-metal monomer, corrosion resistance process will not dissolve any material, no impact on the original solution. The pass hole is easy to be peeled off without residue and has no effect on the original solution.
Curing conditions
Required drying conditions
First printing
Second printing
Double-sided printing
Cabinet oven 
temperature & time
150℃
5min
150℃
3-10min
150℃
15-20min
Infrared tunnel furnace
temperature & time
160℃/180℃
1-1.5min
160℃/180℃
2-3min
160℃/180℃
2-3min
Uv curing
Energy, speed
1000-3000J
4-5min
1000-3000J
3-4min
1000-3000J
3-4min
Fr4 multilayer PCB process capability
NOItemCraft Ability
1Surface FinishHASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
2Layer1-30 layers
3Min.Line Width3mil
4Min.Line Space3mil
5Min.Space between Pad to Pad3mil
6Min.Hole Diameter0.10mm
7Min.Bonding Pad Diameter10mil
8Max.Proportion of Drilling Hole and Board Thickness1:12:05
9Max.Size of Finish Board23inch*35inch
10Rang of Finish Board′s Thickness0.21-7.0mm
11Min.Thickness of Soldermask10um
12SoldermaskGreen,Yellow,Black,White,Red,transparent photosensitive solder mask,Strippable solder mask
13Min.Linewidth of Idents4mil
14Min.Height of Idents25mil
15Color of Silk-screenWhite,Yellow,Black
16Date File FormatGerber file and Drilling file,Report series,PADS 2000 series,powerpcb series,ODB++
17E-testing100%E-Test:High Voltage Testing
18Material for PCBHigh TG Material:High Frequence(ROGERS,TEFLON,TADONIC,ARLON):Haloger free Material
19Other TestImpedance Testing,Resisitance Testing,Microsection etc
20Special Technological RequirementBlind&Buried Vias and High Thickness Copper
PCBQUICK PCB Certificates
UL, TS16949, ISO14001, ISO9001-2008, and RoHS
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