High Frequency PCB Board︱Microwave PCB Fabrication
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1.Double Sided PCB ，Multilayer PCB
Mixed structure: including high performance special plate, P sheet + common performance plate and P sheet mixed pressure structure plate
2.The high frequency substrate + normal FR4 substrate hybrid composite board
3.High frequency substrates + metal based high frequency metal based printing plates
OEM high frequency pcb board stack up
For the characteristics of high speed and high frequency of PCB, two technical approaches are mainly adopted:
1. Make this development into high-density wiring with fine wires and spacing, small aperture, thin shape and conduction, and high reliability of insulation. This can further shorten the signal transmission distance to reduce its loss in transmission.
2. Adopt substrate material with high speed and high frequency characteristics. This requires a deeper understanding of this kind of substrate material, and the research work to find out and master the process method of preparation control, so as to achieve the manufacturing process, performance and cost requirements of the selected substrate material and achieve the goal of reasonable matching.
OEM high frequency pcb board Process
OEM high frequency pcb board FAQ
Q : How long does the mass production time of HDI PCB design and manufacture?
A : It is about 10 - 15 working days after confirming of PCB Gerber File.
Q : What color is the solder mask of my design OEM high frequency pcb board?
A : It is black,of course,you can choose another color in your HDI PCB Board.
Q : What kind of surface technics do you use in OEM high frequency pcb board?
A : It usually uses ENIG.
Q : How many layers can you produce of OEM high frequency pcb board ?
A : We can produce multilayer HDI printed circuit board about 4-30 layers.
Q : What is the process capability of OEM high frequency pcb board?
A : Maybe you can see “WHAT PROCESS CAPABILITY CAN WE MAKE FOR HDI PCB” for detailed imformation.
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