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Express fabrication fr4 pcb stencil -Blue multilayer circuit board

Express fabrication fr4 pcb stencil -Blue multilayer circuit board

Express fabrication fr4 pcb stencil -Blue multilayer circuit board
Express fabrication fr4 pcb stencil -Blue multilayer circuit boardExpress fabrication fr4 pcb stencil -Blue multilayer circuit boardExpress fabrication fr4 pcb stencil -Blue multilayer circuit boardExpress fabrication fr4 pcb stencil -Blue multilayer circuit boardExpress fabrication fr4 pcb stencil -Blue multilayer circuit board
CategoriesMultilayer PCB
AlbumView larger image
BrandPCBQuick
Solder maskBlue
Silkscreen Colorwhite
FOB portShenZhen
Download DOC
Update Time2019-02-21
Detail Information
Process capability

NO

Item

Craft Ability

1

Surface Finish

HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc

2

Layer

2-30 layers

3

Min.Line Width

3mil

4

Min.Line Space

3mil

5

Min.Space between Pad to Pad

3mil

6

Min.Hole Diameter

0.10mm

7

Min.Bonding Pad Diameter

10mil

8

Max.Proportion of Drilling Hole and Board Thickness

1:12:5

9

Max.Size of Finish Board

23inch*35inch

10

Rang of Finish Boards Thickness

0.21-7.0mm

11

Min.Thickness of Soldermask

10um

12

Soldermask

Green,Yellow,Black,White,Red,transparent photosensitive solder mask,Strippable solder mask

13

Min.Linewidth of Idents

4mil

14

Min.Height of Idents

25mil

15

Color of Silk-screen

White,Yellow,Black

16

Date File Format

Gerber file and Drilling file,Report series,PADS 2000 series,powerpcb series,ODB++

17

E-testing

100%E-Test:High Voltage Testing

18

 

Material for PCB

High TG Material:High Frequence(ROGERS,TEFLON,TADONIC,ARLON):Haloger free Material

19

Other Test

Impedance Testing,Resisitance Testing,Microsection etc

20

Special Technological Requirement

Blind&Buried Vias and High Thickness Copper

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