FR4 8 layer PCB- 94V 0 with gold plating process
HDI board | 1-layer PCB | 2-layer PCB | 4-layer PCB | 6-layer PCB |
8- layer PCB | 10- layer PCB | 12- layer PCB | 14- layer PCB | 16- layer PCB |
Aluminium PCB | Multi-layer PCB | FPC | Rigid-flexible PCB | Copper PCB |
PCB Assembly | Rigid circuit board | LED PCB |
PCB Made Ability:
Item | Technical Standards |
Rise | 1-20 Layer |
Material | FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum |
Thickness | 0.2mm-3.2mm(8mil-126mil) |
Minimum thickness | 0.075mm(3mil) |
Cu | 1/2 oz min;5 oz max |
Min line width/spacing | 0.075mm/0.1mm(3mil/4mil) |
Min drill hole | 0.2mm(8mil) |
Punching the smallest aperture | 0.9mm(35mil) |
Surface finish/treatment | HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating |
The largest size puzzle | 610mm×508mm |
Tolerance | Pore spaces | +/-0.075mm(3mil) CNC Driling |
Line width | +/-0.05mm(2mil) or |
+/-20% of original artwork |
Aperture | PTH L:+/-0.075mm(3mil) |
Non-PTH L:+/-0.05mm(2mil) |
Appearance Tolerance | +/-0.125mm(5mil) CNC Routing |
+/-0.15mm(6mil) by Punching |
Warp | 0.70% |
Insulation Resistance | 10Kohm-20Mohm |
Conduction Resistance | <50ohm |
Test voltage | 10-300V |
MLB | Interlaminar deviation | 4 layers:0.15mm(6mil)max |
6 layers:0.25mm(10mil)max |
