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Rigid PCB

As we know, the rigid  PCB prototype classification has the following main points: 
FR-4 (glass fiber cloth base), CEM-1/3 (glass fiber and paper composite substrate), FR-1 (paper-based copper clad composite board), metal-based copper clad board (mainly aluminum, a small amount of iron base More types of materials than are currently common, often referred to as rigid PCBs. Among them, FR4 is the most common material. The FR4 material is usually TG 130. More than 130, we call it a special pcb material.
Rigid PCB product manufacturing capability
NoprojectProcess capability
1Surface treatmentHASL, gold immersion, gold plating, OSP, immersion tin, etc.
2Floor1-30 floors
3Minimum line width3mil
4Min.Line Space3mil
5Minimum spacing between Pad.Pad3mil
6Min.Hole diameter0.10 mm
7Min.Bonding Pad Diameter10MIL
8Maximum drilling ratio and thickness1:12:05
9Complete the board's Max.Size23inch * 35inch
10Plate thickness0.21-7.0mm
11Minimum thickness solder mask10um
12Solder maskGreen, yellow, black, white, red, transparent photosensitive solder mask, peelable solder mask
13Minimum Idents line width4MIL
14The smallest IdentsHeight25mil
15Screen colorWhite, yellow, black
16Date file formatGerber files and drilling files, report series, PADS 2000 series, powerpcb series, ODB ++
17E-test100% electronic test: high voltage test
18PCB materialHigh TG material: high frequency (ROGERS, TEFLON, TADONIC, ARLON): no Haloger material
19Other testsImpedance test, resistance test, microdissection, etc.
20Special technical requirementsBlind and buried holes and high thickness copper
Rigid PCB
Printed Circuit Board Manufacturer - PCBQuick
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Material: FR4
Plate thickness: 1.6mm
Copper thickness: 35um
Minimum hole: 0.2mm
Solder Mask: Green
Screen color: white
Surface technology: no HAL

Material: FR4
Plate thickness: 1.6mm
Copper thickness: 35um
Minimum hole: 0.2mm
Solder Mask: Green
Screen color: white
Surface technology: no HAL

Material: FR4
Plate thickness: 1.6mm
Copper thickness: 1 ounce
Minimum hole: 0.2mm
Solder Mask: Green
Screen color: white
Surface technology: HASL
                              Gold finger


Material: FR4
Plate thickness: 1.6mm
Copper thickness: 35um
Minimum hole: 0.2mm
Solder Mask: Green
Screen color: white
Surface technology: no HAL
                              CNC
Material :FR4
Board Thickness :1.6mm
Copper Thickness: 35um
Min Holes : 0.8mm
Solder mask :White
Silkscreen Color : Black
Surface Technics :HAL-Free

Material :FR4
Board Thickness :1.6mm
Copper Thickness: 35um
Min Holes : 0.2mm
Solder mask :Red
Silkscreen Color :White
Surface Technics : ENIG

Material :FR4
Board Thickness :1.6mm
Copper Thickness: 35um
Min Holes : 0.2mm
Solder mask :Blue
Silkscreen Color :White
Surface Technics :HAL-Free

Material :FR4
Board Thickness :1.6mm
Copper Thickness: 35um
Min Holes : 0.2mm
Solder mask :Black
Silkscreen Color :White
Surface Technics :HAL-Free

Material: Copper
Thickness: 1.6mm
Solder mask: white
Screen printing: black
Type: single layer
Technology: ENIG
Material: FR4
Thickness: 0.53 +/- 0.1mm
Solder Mask: Green
Screen printing: white
Type: 6-layer pcb
Technology: 6-layer blind via PCB, minimum hole: 0.2mm, minimum line width and space: 3mil / 3mil. BGA 0.5mm,

Material: FR4
Thickness: 1.6mm
Solder Mask: Green
Screen printing: white
Type: 4 layer pcb
Technology: ENIG
                 


Material: FR4
Thickness: 1.6mm
Solder mask: black
Screen printing: white
Type: 4 layer pcb
Technology:    ENIG

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