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6Layer Blind Buried Via HDI PCB

6Layer Blind Buried Via HDI PCB

6Layer Blind Buried Via HDI PCB
6Layer Blind Buried Via HDI PCB6Layer Blind Buried Via HDI PCB6Layer Blind Buried Via HDI PCB6Layer Blind Buried Via HDI PCB
CategoriesSpecial Board
AlbumView larger image
BrandPCBQuick
MaterialFR4
Board Thickness0.53+/-0.1mm
Copper ThicknessInner layer 17um,External layer
Soldermask ColorGreen
Silkscreen ColorWhite
Surface TechnicsENIG
FOB portShenzhen,Hongkong
Terms of PaymentL/C, D/A, D/P, Western Union, MoneyGram, T/T, Paypal
Update Time2019-03-20
Detail Information

6Layer Blind Buried Via HDI PCB

Product Description


Board Thickness: 0.53+/-0.1mm

Soldermask Color: Green

Surface Technics: ENIG(Au min 1.2uinch,Ni min 100uinch)

Min Line width and space:3mil/3mil

BGA 0.5mm

Drill layer stack up: L1-L2,L2-L3,L3-L4,L4-L5,L5-L6,L1-L6


HDI PCB Manufacturing Process


HDI PCB Stack Up






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