High Density Intrerconnection
HDI (High Density Intrerconnection) is defined as substrate or board with the Microvia of aperture below 6mil, hole pad below 0.25mm, connect pad density above 130 points / square inch , wiring density above 117 inches / square inch and line width / spacing below 3mil/3mil. HDI is mainly used in mobile phones, cameras, camcorders, laptops, network card, IC carrier board, military, medical and other different areas.
Maybe it’s helpful to you:
- Building D, Xintai Industrial Park, Xitou Second Industrial Zone, SongGang Town,Bao'an,Shenzhen,China
Focus on mobile phone clients