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high density interconnect pcb 6Layer Blind Buried Via HDI PCB

high density interconnect pcb 6Layer Blind Buried Via HDI PCB

high density interconnect pcb 6Layer Blind Buried Via HDI PCB
high density interconnect pcb 6Layer Blind Buried Via HDI PCBhigh density interconnect pcb 6Layer Blind Buried Via HDI PCBhigh density interconnect pcb 6Layer Blind Buried Via HDI PCBhigh density interconnect pcb 6Layer Blind Buried Via HDI PCB
CategoriesSpecial PCB Manufacturing
BrandPCBQuick PCB Manufacturer and Assembly
MaterialFR4
Board Thickness0.53+/-0.1mm
Copper ThicknessInner layer 17um,External layer
Soldermask ColorGreen
Silkscreen ColorWhite
Surface TechnicsENIG
FOB portShenzhen,Hongkong
Terms of PaymentL/C, D/A, D/P, Western Union, MoneyGram, T/T, Paypal
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Update Time2021-07-25
Detail Information

high density interconnect pcb 6Layer Blind Buried Via HDI PCB

Product Description


Board Thickness: 0.53+/-0.1mm

Soldermask Color: Green

Surface Technics: ENIG(Au min 1.2uinch,Ni min 100uinch)

Min Line width and space:3mil/3mil

BGA 0.5mm

Drill layer stack up: L1-L2,L2-L3,L3-L4,L4-L5,L5-L6,L1-L6


HDI PCB Manufacturing Process


HDI PCB Stack Up






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